Fabricante: Aries Electronics
Serie: Lo-PRO®file, 513
Paquete: Bulk
Estado del producto: Active
Tipo: DIP, 0.9\ (22.86mm) Row Spacing Number of Positions or Pins (Grid): 10 (2 x 5) Pitch - Mating: 0.100\ (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0碌in (0.25碌m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100\ (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0碌in (5.08碌m)
