24-6554-16 Aries Electronics Zócalos de CI

Fabricante: Aries Electronics
Serie: 55
Paquete: Bulk
Estado del producto: Active
Tipo: DIP, ZIF (ZIP), 0.6\ (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100\ (2.54mm) Contact Finish - Mating: Nickel Boron Contact Finish Thickness - Mating: 50.0碌in (1.27碌m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100\ (2.54mm) Contact Finish - Post: Nickel Boron Contact Finish Thickness - Post: 50.0碌in (1.27碌m)